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Selection Guide

Correct Thermal Interface Material Selection Guide

Selection of the correct Thermal Interface Material (TIM) is critical to the performance for each device. Proper selection is based on various material properties; Thermal Resistance, Voltage Isolation, Service Temperature and Wetting Properties. While selecting the right material involves considering the chemical and physical properties of the material, it also means choosing a product that will ensure the longest possible life expectancy in the working environment. Using the best material for the job can decrease your overall cost because otherwise similar products may have different price/performance ratios.

Thermal Interface Gap Filler GP Series UTP100 TP400 TP300 TP250 TP200 TP150 TP080 Form Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad Polymer Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Color Brown-Red Shallow Blue Bright Blue Bright Yellow Dark Gray Dark Gray Gray Thickness (mm) 0.25 - 5.0 0.5 - 5.0 0.5 - 5.0 0.5 - 5.0 0.5 - 5.0 0.5 - 5.0 0.25 - 5.0 Density (g/cc) 2.5 3.15 2.7 2.93 2.79 2.5 2.2 Thermal Conductivity (W/m-K) 1.0 4.0 3.0 2.5 2.0 1.5 0.8 Sheet Stock Yes Yes Yes Yes Yes Yes Yes Fabrication Die cut Die cut Die cut Die cut Die cut Die cut Die cut Multilayer Capable 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up Ultra Soft Min. Thickness 0.25mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.25mm up Electric Insulation High Low Low Low High High High Download the Thermal Interface Gap Filler datasheets
Functional Thermal Interface Material Material Series TC Series TG Series PCM Series Form Insulator Pad Thermal Grease Electrical conductive thermal pad Polymer Silicone / Ceramic particles Silicone / Ceramic particles Silicone Color Megenta White Gray Thickness (mm) 0.23/0.3/0.45 0.5 - 6.0 < 0.5 Density (g/cc) Vary 2.9 Vary Thermal Conductivity (W/m-K) 1.6 - 3.5 3.0-5.0 2.5 - 4.0 Sheet Stock Yes No Yes Fabrication Die cut --- Die cut Multilayer Capable N/A N/A N/A Ultra Soft Min. Thickness N/A N/A N/A Electric Insulation Superior Fair Fair Download the Functional Thermal Interface Material datasheets

sg-thermalpad.com Can Help You Choose the Right Material

Thermal interface materials can be used in a wide range of electronic products ranging from automotive electronics, telecom, consumer, lighting, military, medical, power supplies, wireless, personal computer, LED, LCD TV, motherboard, DRAM memory module, cooler, vehicle control module, notebook computer etc…wherever there is thermal management issues Our products can provide a cost-efficient and manufacturing-friendly solution. sg-thermalpad.com offers an industry-leading breadth of expertise in both standard and specialized interface materials. We have an experienced engineering and development team that has the material knowledge to assist you in selecting the right material for your application.

Thermal Grease is an opaque white heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat sink seal, this facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall efficiency and performance of the device. We strive to provide complete solutions every time for our customers, so we offer a wide range of engineering services and technical support for both new and existing applications.

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With so many options, it’s clear that now more than ever you should seek expert help to specify materials. You can place an order online quickly and easily.